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Essential High-speed PCB Design for Signal Integrity
Technical Details
Course Summary
By applying basic physical principles, this course seeks to develop an
understanding of the key issues of high-speed design, all of which are needed to ensure a
successful design for signal integrity. These range from controlling reflections and
crosstalk to the design of the power distribution system and the PCB layer structure.
Practical implementation is considered throughout.
The course is liberally illustrated with examples and “what if” scenarios showing the effects of varying different parameters, enabling participants to develop an understanding of their relative importance and magnitude. Helpful guidelines on assessing and implementing best practice are included.
Essential High-speed PCB Design for Signal Integrity covers the following areas in detail:
- The impact, issues and challenges of high-speed design, in particular the importance of wave
propagation and the frequency components of a digital signal, derived from its risetime.
- The key roles of capacitance and loop inductance in determining frequency-dependent
signal behaviour on a PCB.
- Why we need to control the impedance of the power distribution system over a wide
frequency range. Frequency analysis of decoupling networks. Capacitor types and limitations.
Increasing the bandwidth. Plane capacitance, impedance and inductance.
Alternative approaches to power distribution.
- The need for track impedance control. Effects of PCB materials, stackup, geometry and fabrication.
Track impedance, reflections, and properties of different types of line terminations.
- When differential transmission may be beneficial. Differential and common mode currents.
Routing differential tracks – coupled lines, odd and even modes. Terminating differential transmission lines.
- Controlling crosstalk due to electric and magnetic field coupling between PCB tracks.
Near end and far end crosstalk. Effect of coupled length. Crosstalk from multiple lines,
Jitter due to crosstalk
- The essential features of ICs for high-speed design. I/O characteristics,
equivalent circuits and models. Behavioural device models - I-V curve extraction.
Transient characteristics and transition timing. IBIS standards, file structure and evolution.
- PCB routing topologies. Track routing effects – capacitive and inductive discontinuities.
Effects of corners, connectors, and vias. Delay equalisation. Incident and reflected mode switching.
Topology types – branching and non-branching. Stubs, routing constraints, multiple capacitance loading,
clock distribution.
- Effects of PCB structure and fabrication. The effects of different layer stackups, fabrication variables,
and material properties. PCB track impedance testing.
The course is suitable for:
- Digital design engineers who either have no experience of
the background and methods required for high-speed PCB design,
or who have some experience but would benefit from a more
complete and in-depth knowledge of signal integrity issues and possible design techniques.
- PCB designers working on digital boards where high-speed design
rules governing track impedance control, line terminations, routing to minimise noise
coupling etc. are required.
Workshop Agenda
Module 1 - High-speed design overview
- Design issues for the engineer and for the PCB layout designer
- When is a design “high speed”?
- Industry drivers force high speed
- Signal integrity and the high speed challenge
- Why we need to consider wave propagation and wave properties
- The PCB contribution
- High speed PCB design – key requirements
Module 2 - Fundamental electrical concepts
- Time domain and frequency domain
- Signal bandwidth - analog signals and digital signals
- Digital waveforms
- Clock speed versus edge speed - effect of signal risetime
- Effective operating frequency and knee frequency
- Current, voltage and resistance
- Electric fields, capacitance and dielectric constant
- Magnetic fields and inductance - self inductance on PCBs
- Effect of circuit components on signal waveform - transmission lines
- Current paths on a PCB
- Attenuation of signals on lines - skin effect and loss tangent
Module 3 - Power delivery
- Power requirements
- Coping with changing currents - induced noise
- Board level and component level decoupling
- Practical limitations - bandwidth of capacitors
- Three problems with the traditional approach to decoupling
- Expected versus actual response of decoupling networks
- The alternative approach to power delivery
- Flattening the impedance response
- Supplying charge - component current risetimes
- Power - ground plane resonance
- Summary - two approaches to power delivery
Module 4 - PCB transmission lines
- Transmission line velocity and delay
- Characteristic impedance
- Material and stackup effects
- Geometry and fabrication effects
- Propagation of a voltage step
- Transmission line input impedance
- Reflection from a terminated line - different cases
- Impedance control by line termination
- Series and parallel termination
Module 5 - differential transmission
- Why use differential transmission? (1)
- Differential signalling
- Effects of equal and unequal transmission line lengths
- Differential and common mode currents
- Routing differential tracks close together
- Coupled lines - current, voltage and impedance (odd and even mode)
- Rules for routing differential transmission lines
- Line terminations
- Do we need to terminate for even mode?
- Why use differential transmission? (2)
Module 6 – Crosstalk
- Capacitive and inductive crosstalk
- Dependence on edge rate
- Coupling factors - solid ground plane
- Coupled lines and coupling mechanisms - forward and backward crosstalk
- Where do the coupled signals go?
- Near end and far end crosstalk
- Effect of coupled length
- Other coupling and ground plane effects
- Crosstalk from multiple lines
- Crosstalk induced jitter
- Crosstalk control in PCB design – parts, planes, tracks, connectors, terminations
Module 7 – Modelling drivers and receivers
- IC device characteristics - drivers and loads, bipolar and CMOS v
- Simple equivalent circuits and models - device output
- Real devices – modelling input, output and I/O ports v
- Behavioural device model
- IBIS - I/O Buffer Information Specification – content and file structure
- Measuring and extracting I-V curves (in principle and in practice)
- Transient characteristics - transition timing
- IBIS standards - evolution and key points
Module 8 - PCB routing topologies
- Transmission line types, nets and buses
- Track routing effects -capacitive and inductive discontinuities
- Discontinuity effects from corners, connectors, vias and microvias
- Serpentine tracks (delay equalisation)
- Incident and reflected mode switching
- Overshoot and ringing
- Topology types - branching and non-branching, stubs, routing constraints
- Multiple capacitance loading
- Clock distribution
- General principles for routing
Module 9 - PCB structure, manufacture and measurement
- Layer stacking effects and principles – power, ground and routing layers
- Effects of PCB fabrication process variables on high-speed designs
- The influence of key PCB materials parameters
- Measurement of transmission line impedance
- TDR testing of PCB track impedance
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For over 10 years.. |
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Esperan has been providing VHDL training
and Verilog training in UK, US, Canada, Western Europe, South Africa and throughout the world. |
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