Overview
Fast edge speeds are now the norm for many standard digital device families,
and their effects have to be considered in PCB design to minimise elctromagnetic
interference, even at modest clock speeds.
This course builds seamlessly on the principles and practice
established in the Essential High-speed PCB Design class, extending them to
develop techniques for design and test at
frequencies above 1 GHz for Gb/s serial transmission and for controlling the
generation and propagation of EMI at the PCB level. Key topics cover signal quality,
material effects and EMC from components to backplanes.
Note: This is an integrated course where the concepts and methods developed in the Essential High-Speed PCB Design class
are applied directly to the topics in this class. Delegates to this course are
therefore strongly advised to attend the Essential High-speed PCB Design class first.
Duration
The course is based around a 2-day agenda, although it can be combined with
the High-Speed PCB Design course to create a 5-day agenda.
We can also offer standard or customized versions of this course onsite or at the location of your choice.
Objectives
The course covers the following areas in detail:
- The impact, issues and challenges of high-speed
design
- How different PCB materials and layer stack-ups
play a vital role
- The principles of EMI generation and why
it has become a major issue
- EMI control at component level and at PCB
level
- The roles that signal routing, interconnection
and grounding play in EMI (through tracks, planes, connectors,
cables and backplanes), and strategies to control its
propagation
Prerequisites
Delegates should be familiar with basic electrical concepts. No prior knowledge of PCB design
tools is required or assumed.
