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Minimizing EMI - Overview

PCB design at RF - multi-Gigabit transmission, EMI control, and PCB materials

Technical Details

Overview
Fast edge speeds are now the norm for many standard digital device families, and their effects have to be considered in PCB design to minimise elctromagnetic interference, even at modest clock speeds.

This course builds seamlessly on the principles and practice established in the Essential High-speed PCB Design class, extending them to develop techniques for design and test at frequencies above 1 GHz for Gb/s serial transmission and for controlling the generation and propagation of EMI at the PCB level. Key topics cover signal quality, material effects and EMC from components to backplanes.

Note: This is an integrated course where the concepts and methods developed in the Essential High-Speed PCB Design class are applied directly to the topics in this class. Delegates to this course are therefore strongly advised to attend the Essential High-speed PCB Design class first.

Duration
The course is based around a 2-day agenda, although it can be combined with the High-Speed PCB Design course to create a 5-day agenda. We can also offer standard or customized versions of this course onsite or at the location of your choice.

Objectives
The course covers the following areas in detail:

  • The impact, issues and challenges of high-speed design
  • How different PCB materials and layer stack-ups play a vital role
  • The principles of EMI generation and why it has become a major issue
  • EMI control at component level and at PCB level
  • The roles that signal routing, interconnection and grounding play in EMI (through tracks, planes, connectors, cables and backplanes), and strategies to control its propagation

Prerequisites
Delegates should be familiar with basic electrical concepts. No prior knowledge of PCB design tools is required or assumed.

MINIMISING EMI
 
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